Date : 5 Dec 2010-Sunday
Registration Timing : 09:00 am to 12 noon
Venue : Tata Consultancy Services,
Abhilash Software Development Centre,
Plot No. 96, EPIP Industrial Area, Whitefield,Bangalore-560 066
JOINING LOCATION : Bangalore
Skill | Experience Band | Requirement(JD) |
Consumer Electronics | More than 3 Yrs | Video/ Audio/Image Codec/Algorithms development and platform porting. |
| Code optimization for power, performance and footprint | ||
| Multimedia frameworks like Direct-X,Direct-Shaw, Open-GL etc. | ||
| Experience in Device driver development, OS porting | ||
| Experience of working in minimum 1-2 industry RTOS like Vxworks, ITRON, pSOS, Linux,Nucleus, Symbian, WinCE,Android etc | ||
| Design, Develop and test hardware for consumer product | ||
| Complete experience of SDLC | ||
LTE PHY | More than 3 Yrs | 1. System level understanding of wireless technologies in one of many of the following: GSM, LTE, WiMAX, WCDMA, CDMA2000, EVDO. |
| 2. System level integration and testing of DL/UL channels WiMAX/LTE preferable. | ||
| 3.HW/SW Partitioning, Multicore Design,Experience on Multicore Platform (Like TI 6488, FreescaleMSC8144, MSC8156,etc) | ||
| 4. Code Composer Studio/Code warrior Developemnt Environment/Debugging Tool | ||
| 5. Experience on Multicore Platform (Like TI 6488, FreescaleMSC8144, MSC8156) | ||
| 6.Interfaces like SRIO, Gigabit Ethernet, PCI Express, etc | ||
| 7. DSP Algorithm Implementation Experience using C/C++, | ||
Image Processing | More than 3 Yrs | · Experience in Image Processing Algorithms for Surveillance, Consumer or Automotive applications |
| · Video/Audio Codec development and platform porting | ||
| · Code optimization for power, performance and footprint | ||
| · Experience of working in minimum 1-2 industry codec standards like H.264,MJPEG2000,MJPEG,MPEG- 4,AAC,MP3,WMA,AMR,JPEG etc | ||
LTE Protocol Stack | More than 3 Yrs | Minimum 7-8 years experience out of total Telecom experience in software development in LTE/UMTS/GPRS/GSM/EDGE protocol stacks preferably eNB and UE side. |
Android | More than 3 Yrs | Smartphone application development experience in Android platform |
| Experience in JNI/fundamentals of JAVA | ||
| Hands on experience in Android middelware and library development | ||
| Strong C and C++ Programming skills | ||
| Application development experience in Linux, QNX, VxWorks,PrKernel etc | ||
| Experience in porting Linux/ Android OS to Intel,TI and ARM platforms | ||
Auto infotainment | More than 3 Yrs | 1. C |
| 2. Embedded application development | ||
| 3. Knowledge of Automotive electronics hardware | ||
| 4. Software design experience | ||
DSP Wireless Developer | Between 4-10 years | >Hands on experience in the field of DSP implementation of wireless standards at the physical layer level. >Should be well versed with physical layer blocks/alogirthms, signal processing algorithms, real time embedded C implementation. >Knowledge of 3GPP standards like GSM/EDGE, W-CDMA, HSPA, LTE etc is also required. >Hands on experience of Matlab and version management tools like clearcase is desirable. |
KBE | More than 3years | > Skill set : C, Ufunk, KF. >Must experience in UG customization ( Assembly and Drafting module). > Should have worked in TCE & UG. |
Product Design with ProE wildfire | Between 4-6 years | Product Design Experience. Experience in Designing of Plastic, Sheet metal & machined components. ProE (Wildfire 2.0 and above ). GD & T Minimum 2 to 3 yrs of Industry Experience. Experience in designing linear slides and machine elements. Knowledge in manufacturing process. DFM/DFA. Creating manufacturing drawing. Knowledge of Tolerance Stack-up Analysis |
Electrical panel design | 2 to 4 years | Experience in Electrical Panel Design. AutoCAD. Knowledge in PLC hardware (AB, Siemens & MODICON) Knowledge in PLC, HMI and SCADA programming. Experience in other panels like power distribution, MCC design. Knowledge in P&ID and Single line diagram. VBA/VB Programming. Communication Protocols (MODBUS). |
Design Engineer | 5 to 7 years | Experience in Designing of Plastic, Sheet metal & machining components. SolidWorks (Solid & Surfaces). GD & T Experience in Packaging Mechatronic instruments (Hand held & Desktop) Knowledge in manufacturing process. DFM/DFA. Creating manufacturing drawing. Knowledge of Stack-up Analysis |
Techincal Writers | 2 - 3 Years | Good writing skills |
| Good communication skills | ||
| Writing, editing, and review of Technical manuals | ||
| Working with illustrations | ||
| FrameMaker | ||
| Basics of Adobe Illustrator | ||
| Basics of Adobe Photoshop |
Eligibility Criteria
• BE/B.Tech/MCA/M.Sc/MS with minimum 3 years of relevant experience post Qualification IT- Experience.
• Bsc Graduates with minimum 4+ years of relevant experience post qualification IT Experience.
• Only Full Time courses would be considered.
• Consistent academic records Class X onwards (Minimum 50%)
• Candidate who have attended TCS interview in the last 6 months need not apply.
*Candidates need to carry (1) Resume copy, (2) Pay Slips and (3) Passport size photograph(4)EP Number
*Candidates must bring a copy of filled TCS Application form while coming for the interview.
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