Wednesday, July 25, 2012

TCS - referral walk-in on July 28, 2012 - Bangalore - Whitefield



Date 28-July-2012
Venue Abhilash Building Plot No 96,
EPIP Industrial Area,
Whitefield Road
Bangalore – 66
Registration Time 9:30am -12:30Noon
Skill Requirement (JD)
CAE Analyst - Body NVH CAE Analyst - Body NVH (4+yrs)BE/Mtech/MS in Mechanical/Automobile Engineering
experience in Vehicle acoustic analysis
Experience in working with body NVH
Good  Hands on experience in CAE tools like Nastran, Hyperworks
Excellent simulation and analysis skills
Strong in fundamentals of NVH
Good Understanding of vehicle structure and structure toplogy Design.
Good communication skills(written/oral)
Have good experience in leading the team and understanding the client requirements
CAE Analyst – Durability CAE Analyst – Durability (4+yrs)BE/Mtech/MS in Mechanical/Automobile Engineering
Experience in Durability analysis
Good  Hands on experience in CAE tools like Abaqus, Nastran, Hyperworks
Exposure to the Fatigue tools like N-code and FEMFAT is an additional advantage
Strong in fundamentals of Durability
Good Understanding of vehicle structure and structure toplogy Design.
Good communication skills(written/oral)
Have good experience in leading the team and understanding the client requirements
Informatica Developer Informatica Developer(4+yrs)-Informatica Development Experience
Informatica Lead Informatica Lead (6+yrs) Informatica Development and lead experience.
Datawarehousing Project Manager Datawarehousing project Manager(10+yrs) Datawarehousing experience
OBIEE Developer OBIEE Developer (4+yrs)OBIEE Development experience.
Oracle with Sybase Oracle with Sybase(4+yrs) Oracle with Sybase Development Experience.
System Architect  System Architect (9-15yrs)
System Architect  TD-LTE-A:
Definition and design of Layer 1 & Protocol for the  TD-LTE-A wireless standard.
- Architecture definition for TD-LTE-A Solution for Mobiles and eNodeB
- Mapping of TD-LTE-A features and standard requirements to Firmware, algorithm and protocol stack requirements
- Breakdown of requirements into Firmware & stack components
- Identify all relevant FW aspects for the TD-LTE-A standard
- Define scheduling and task priorities of Firmware & stack components with respect to given real-time constraints and system resources (MIPS, memory) in a TD-LTE-A eNodeB system
-  Multicore architecture ,Concepts for partitioning between Hardware and Firmware (HW/FW split) in a  TD-LTEsystem
- Verification concepts for TD-LTE-A FW on block and system level
- Scheduling software architecture and implementation
- Provide guidelines for implementation aspects of modem algorithms in a TD-LTE system
- Customer interface/Abstraction for TD-LTE-A FW related modules
- In-depth Knowledge of 3GPP standards like LTE-A, GSM/EDGE, W-CDMA, HSPA, TD-SCDMA, CDMA 1x/EvDO etc required.
- Hands-on Experience on OEM Hardware platform is essential.
Firmware Architect  Firmware Architect (9 – 15 yrs)
FIRMWARE (DSP, FPGA, ASIC) & Protocol Architect TD-LTE-A:
- Definition and design of Layer 1 Firmware for the TD-LTE-A wireless standard
- Architecture definition for LTE DSP & FPGA firmware
- Mapping of given LTE-A features and algorithms to DSP & FPGA FW requirements
- Define scheduling and task priorities of Firmware components with respect to given real-time constraints and system resources (MIPS, memory) in a TD-LTE system
- Breakdown of requirements into FW components
- Identify all relevant FW aspects in a LTE-A eNodeB wireless system
- Define scheduling and task priorities of FW components with respect to given real-time constraints and system resources (MIPS, memory) in a TD-LTE-A eNodeBs system
- Concepts for partitioning between HW and FW (HW/FW split)
- Customer interface/Abstraction for TD-LTE-A FW related modules
- Interface definition of HW accelerator blocks for selected DSP tasks
- Planning and selection of scheduling software for real-time operation in a LTE-A system
- Verification concepts for DSP FW on block and system level
- Provide guidelines for implementation aspects of modem algorithms
- Support definition and design of HW accelerator blocks for selected DSP tasks
- Definition and design of DSP Firmware for LTE-A TDD (GSM, GPRS, EDGE, EDGE Evolution) & 3G (UMTS, TD-SCDMA, CDMA 1x, HSPA) wireless baseband applications required.
- In-depth Knowledge of 3GPP standards like LTE-A, GSM/EDGE, W-CDMA, HSPA, TD-SCDMA, CDMA 1x/EvDO etc required.
- Hands-on Experience on OEM Hardware platform is essential.
Lead Developer  Lead Developer (5 – 8yrs)
FIRMWARE (DSP, FPGA, ASIC) & Protocol Stack Lead TD-LTE-A:
- Definition and design of Layer 1 Firmware & Protocol Stack for the TD-LTE wireless standard
- Mapping of given LTE features and algorithms to DSP & FPGA FW requirements
- Define scheduling and task priorities of Firmware & Stack components with respect to given real-time constraints and system resources (MIPS, memory) in a TDD LTE-A system
- Breakdown of requirements into FW components & Stack components
- Identify all relevant FW aspects in a LTE-A/Multi-mode eNodeB wireless system
- Define scheduling and task priorities of FW components & Protocol Stack with respect to given real-time constraints and system resources (MIPS, memory) in a LTE-A eNodeB system
- Multicore architecture ,Concepts for partitioning between HW and FW (HW/FW split).
- Concepts for partitioning of Protocol stack funtions between ARM and HW Accelerators
- Customer interface/Abstraction for TDD LTE-A FW related modules
- Interface definition of HW accelerator blocks for selected DSP tasks
- Scheduling software for real-time operation in a LTE-A system
- Verification concepts for DSP FW on block and system level
- Provide guidelines for implementation aspects of modem algorithms
- Support definition and design of HW accelerator blocks for selected DSP tasks
- In-depth Knowledge of 3GPP standards like LTE,GSM/EDGE, W-CDMA, HSPA, TD-SCDMA, CDMA 1x/EvDO etc required.
- Hands-on Experience on OEM Hardware platform is essential.
Developer Developer (3 – 5yrs)
FIRMWARE (DSP, FPGA, ASIC) & Protocol Stack engrs for TD-LTE-A:
- Definition and design of Layer 1 Firmware for the TD-LTE-A wireless standard
- Mapping of given LTE features and algorithms to DSP & FPGA FW requirements
- Define scheduling and task priorities of Firmware components with respect to given real-time constraints and system resources (MIPS, memory) in a TD-LTE-A system
- Breakdown of requirements into FW components
- Identify all relevant FW aspects in a LTE-A  eNodeB wireless system
- Concepts for partitioning between HW and FW (HW/FW split)
- Concepts for partitioning of Protocol stack funtions between ARM and HW Accelerators
- Interface definition of HW accelerator blocks for selected DSP tasks
- Scheduling software for real-time operation in a LTE-A eNodeB system
- Verification concepts for DSP FW on block and system level
- Provide guidelines for implementation aspects of modem algorithms
- Support definition and design of HW accelerator blocks for selected DSP tasks
- In-depth Knowledge of 3GPP standards like LTE-A, GSM/EDGE, W-CDMA, HSPA, TD-SCDMA, CDMA 1x/EvDO etc required.
- Hands-on Experience on OEM Hardware platform is essential.
- Hands on experience of version management tools like clearcase is desirable


* As per the scheme, BYB reward is applicable for 3 and above years of relevant experience.
* All candidates registered in our Careers portal /GRS online will have a fast track process at the drive location.
* The candidate should have the EPIR number at the time of interview.
* EPIR number is mandatory to be eligible for the reward

TCS Eligibility Criteria
  • BE/B.Tech/MCA/M.Sc/MS with minimum 3 years of relevant experience post Qualification IT- Experience.
  • Bsc Graduates with minimum 4+ years of relevant experience post qualification IT Experience.
  • Only Full Time courses would be considered.
  • Consistent academic records Class X onwards (Minimum 50%)  
  • Candidate who have attended TCS interview in the last 6 months need not apply.

Documents to be carried for the walk-in
  • TCS Online Application Form
  • Passport size photo
  • Last 3 months pay-slip copies
  • Copy of PAN Card #
  • Class 10 Mark-Sheet
  • Class 12 Mark-Sheet
  • A copy of resume
  • UG Mark-Sheets & Degree Certificates
  • PG Mark-Sheets & Degree Certificates
  • Previous Experience Certificates or Service Certificate for all the Previous Employment
  • Copy of Relieving Letter (Current Company if applicable)
  • Address Proof (Ration Card / Telephone Bill / Electricity Bill)
  • Citizenship Proof (Passport / Voters ID / Ration Card / Driving Licence)


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